尊龙时凯

New AI Factory Infrastructure Supports Scalable Enterprise-Grade Computing to Support Taiwan’s Leadership in AI【21 November 2025, Taipei, Taiwan】At this year’s Hon Hai Tech Day (HHTD25), Visionbay.ai by Hon Hai Technology Group’s dedicated business unit for AI supercomputing and cloud operations—made its first public debut, announcing plans to build Taiwan’s largest GPU cluster as well as its first supercomputing center deployment built on NVIDIA GB300 NVL72. The NVIDIA GB300 NVL72 systems are scheduled to come online in the first half of next year, marking a significant acceleration in Taiwan’s sovereign AI infrastructure development. As Trusted NVIDIA Cloud Partner (NCP), Visionbay showcased its latest “AI Supercomputing Center & Operations Platform”, demonstrating vertically integrated capabilities across every layer of the AI value chain. The platform introduces a comprehensive end-to-end AI Factory solution—from AI infrastructure to application-layer integration services. This milestone marks a new chapter for Taiwan in the global AI race and positions Visionbay as a core engine of Foxconn’s long-term “3+3+3” strategy, driving sovereign AI development and enabling large-scale industrial transformation. The CEO of Visionbay.ai–Neo Yao emphasized, “To stay competitive in the AI era, Taiwan must rapidly establish scalable and cost-effective AI infrastructure. Only with strong, accessible compute can we accelerate AI adoption, expand industry applications, and cultivate a world-class environment for AI talent and innovation.” By integrating the Group’s strengths in component manufacturing, server R&D, supply-chain integration, cooling technology, and LLM development, Visionbay.ai addresses the key challenges enterprises face—including compute shortages, rising self-build costs, and the lack of a truly enterprise-ready AI integration platform. In a fireside conversation with NVIDIA DGX Cloud Vice President Alexis Bjorlin, both leaders highlighted a major shift in enterprise AI strategy: Enterprises can speed development and deployment of AI by adopting an “existing workflows + AI” approach, shortening the time from AI experimentation to full-scale deployment. The session also underscored the increasing importance of secure, sovereign, local supercomputing enabling enterprises to maintain data residency, safeguard domain knowledge, and reduce dependency on overseas compute resources.   Visionbay’s business model centers on a comprehensive AI Factory ecosystem, offering GPUaaS compute leasing, NVIDIA-native software solutions, and a cloud-based AI App Store. By gaining instant access to high-performance training, fine-tuning, development, and inference capabilities, enterprises can adopt AI with minimal barriers—powered by NVIDIA next-generation accelerated computing architecture. Looking ahead, Visionbay.ai will continue advancing its full-stack AI service capabilities under its mission of “Empowering the Future of AI”. In partnership with government, industry, academia, and startups, Visionbay aims to build the next generation of AI-driven future—starting from Taiwan.  About Visionbay.ai Visionbay is the Hon Hai Technology Group’s dedicated business unit for supercomputing and cloud-AI operations. With a mission to empower Asia’s AI ecosystem, Visionbay integrates national-level computing infrastructure with Hon Hai’s deep strengths in manufacturing, design, and supply-chain orchestration. Its end-to-end AI Factory solutions span high-performance compute, cloud operations, supply-chain integration, AI model and tool development, and an AI App Store. Visionbay.ai helps enterprises accelerate digital and AI transformation while building a trusted and sustainable sovereign-AI ecosystem. To learn more, visit www.honhai.com/Visionbay.ai About Hon Hai Technology Group (“Foxconn”) Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD 6.86 trillion (approx. USD 208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visitwww.honhai.com

NVIDIA, OpenAI, Alphabet, IBM, ABB Robotics, Uber, FUSO Participate Onstage21 November 2025, Taipei, Taiwan – Accelerating its transformation into an AI-powered technology platform service company, Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) on Friday welcomed powerful partnerships, including NVIDIA, OpenAI and Alphabet, and shared its unrivalled strength in vertical integration at its annual flagship technology conference, Hon Hai Tech Day 2025. The speed and progressof the world’s largest electronics manufacturer in the fields of supercomputing, smart manufacturing, intelligent electric vehicles and more came into focus as global AI, tech and automotive bellwethers – in a line-up also spotlighting IBM, ABB Robotics, Uber and Mitsubishi Fuso Truck and Bus Corp – took to the stage on opening day of HHTD25. “Our competitive strength is vertical integration. Our technological depth and manufacturing heritage enables deep collaborations with world-class technology leaders, partners who rely on us because they know that Foxconn can turn ideas into reality – quickly, reliably and at scale,” said Foxconn Chairman Young Liu. “It positions us well as we push into frontier technologies paved open by AI and quantum.” OpenAI CEO Sam Altman spoke for the first time about the significance of a new partnership with Foxconn: “Demand for critical components for AI infrastructure is already far outpacing supply and we expect that will only continue over the coming years. This agreement is about strengthening supply chains to meet existing and future needs across the industry,” Altman said via video. Another powerful partner, Alphabet Chief Product Officer of Other Bets, Hiroshi Lockheimer, said via video, “Foxconn is an important partner to Google and Alphabet, and our collaboration has helped bring to life some of the most important technological innovations of the past decade.” Foxconn, a Taiwan NVIDIA Cloud Partner, known as NCP, is investing US$1.4 billion in an advanced supercomputing center, accelerated by 10,000 NVIDIA Blackwell Ultra GPUs, that will be utilizing next-generationNVIDIA GB300 NVL72 AI infrastructure in the first half 2026.   It would make it among the first in Asia to use the most advanced NVIDIA Blackwell platform, said Neo Yao, CEO of Foxconn subsidiary Visionbay, which is leading the project. Yao discussed the pathway for revolutionary AI factories alongside Alexis Bjorlin, Vice President of NVIDIA DGX Cloud, in the first of two morning talks featuring NVIDIA executives on topics of AI-powered supercomputing and robotics. The roadmap to humanoids in Smart Manufacturing – from simple and fixed; to simple but flexible; to complicated but flexible – and how quantum technologies can have the potential to elevate future AGI to another level, came under discussion. On display at HHTD25’s bigger than ever exhibition area were over 200 products and technologies. A model of an AI-ready modular container data center installed with GB300 AI infrastructure was set up for the first time at HHTD25 exhibition area, demonstrating unrivalled turnkey solutions, covering L1 to L12 manufacturing and strong vertical integration capabilities. Presented for the first time on the HHTD25 stage, the MODEL A is a B-segment class EV, combining artificial intelligence technology and modular versatility to bring diverse application scenarios to a single reference electric vehicle. Among EV reference vehicles, six MODEL B's, some in never before seen colors on the crossover; three unique reference styles of the MODEL A; the award-winning MODEL T electric bus built with Foxconn motor and battery; the midi-size MODEL U for shuttle use; the LMUV MODEL D; and North American variant of the family SUV MODEL C were parked for viewing throughout the HHTD25 hall. HHTD25 runs from November 21-22 at the Taipei Nangang Exhibition Center, Hall 1, 4F.   For more on Hon Hai Tech Day 2025 here. About Foxconn here.

Taipei / Hong Kong – November 20, 2024 – Hon Hai Tech Day will take place on November 21–22 at the Nangang Exhibition Center, spotlighting “The Real-World Applications of Hon Hai’s Three Major Intelligent Platforms Combined with AI Technologies.” The event will fully showcase the Group’s latest advances in AI innovation. FIT Hon Teng (6088.HK), a subsidiary of Hon Hai Precision Industry Co., Ltd. (2317-TW) specializing in connector manufacturing, will present a comprehensive lineup of high-speed connectors, power solutions, and liquid-cooling technologies, highlighting the advantages of the Foxconn Group’s vertically integrated ecosystem. This year, FIT is exhibiting high-speed server interconnects, power delivery solutions, and liquid-cooling products, including the 800V & ±400V Power Busbar for high-voltage systems, the 400A & 100A AC Whip Connectors and the 140kW LC Busbar & UQDB Floating Module for high-current applications. Among them, the 400A AC Whip Connector is the first of its kind in the market, designed to meet emerging requirements for high-power server racks. These technologies drew strong interest from leading CSP R&D teams and key customers during their debut at OCP, and FIT’s LC Busbar and Power Busbar were successfully integrated into the NVIDIA MGX showcase wall. Hon Hai Tech Day will be held on November 21–22 at the Nangang Exhibition Center in Taipei, featuring the Group’s latest technological achievements and industry collaboration initiatives. FIT sincerely invites industry partners, media, and the public to visit the exhibition and witness the newest developments of the Hon Hai Technology ecosystem. For more information about Hon Hai Tech Day (HHTD), please visit the official Hon Hai website: HHTD – Hon Hai Tech Day.

21 November 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) and Intrinsic are launching a joint venture that will in partnership make the intelligent factory of the future a reality. AI-enabled robotics holds enormous potential for the manufacturing sector and how things are made on the factory floor, where operations need to be more flexible, adaptive and cost effective in the future. Specifically in electronics assembly – an industry experiencing massive growth with the AI boom, but also some of the most persistent robotics issues in manufacturing – there is ample opportunity to modernize production, and enable automation for an entirely new segment of the electronics market. There is more demand than ever in electronics manufacturing for the likes of server trays, GPUs and data centers – yet AI server manufacturing, for instance, is still a mix of rigid automation and manual production. The focus of the US-based joint venture will be achieving a step change in electronics assembly and manufacturing broadly. The goal will be to shift from product-specific automation solutions requiring significant re-engineering across product generations, to more general-purpose intelligent robotics – as well as automating previously manual processes, with the eventual goal of full factory orchestration and automation. Initially our collaboration will cover a range of critical use cases across assembly, inspection, machine tending and logistics applications. Intrinsic Flowstate, a web-based developer environment, will provide a common tool for Foxconn and Intrinsic teams to leverage industry- leading AI capabilities, such as the Intrinsic Vision Model (IVM) to automate newly possible solutions in electronics assembly. Young Liu, Chairman and CEO of Foxconn, said: "In working with Intrinsic, we are able to tap their deep expertise in AI-driven robotics. This synergy complements our global manufacturing leadership, enabling us to collaboratively unlock the factory of the future." Wendy Tan White, CEO of Intrinsic, said: “Together we’re working to bring the value of AI into the physical world. By marrying Intrinsic’s expertise in AI-driven robotics software – as well as Alphabet’s deep expertise in applied research and platform development – with Foxconn’s longstanding expertise with worldwide production, world-class facilities, and vision for the future of manufacturing, we will accelerate the adoption of AI where it is most needed and valuable today. The partnership with Foxconn provides an incredible opportunity to scale these solutions broadly.”   Dr. Zhe Shi, Chief Digital Officer of Foxconn, said: “Intrinsic has led the way when it comes to building an AI-integrated platform and AI-enabled robotic capabilities that can scale. In working together, we’ll be able to ensure Foxconn's Smart Manufacturing platform will enable intelligent automation fully across our factories, from data management to robotics, AI, and digital twins. This partnership will help revolutionize our factory operations, making them even more flexible, adaptable, skill-based, and scalable. From individual tasks at the robot level, to full production lines and plant management, we’re excited to be building the factory of the future together.”   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

21 November 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) and OpenAI today announced a collaboration focused on design work and U.S. manufacturing readiness for the next generation of AI infrastructure hardware. As part of this work, OpenAI will share insight into emerging hardware needs across the AI industry to help inform Foxconn’s design and development efforts for hardware to be manufactured at Foxconn’s U.S. facilities. While this initial agreement does not include purchase commitments or financial obligations, OpenAI will have early access to evaluate these systems and an option to purchase them. As AI capabilities continue to advance, so has the need for a new class of physical infrastructure that is purpose-built for the demands of advanced models. By combining OpenAI’s insight into the needs of today’s and future models with Foxconn’s manufacturing expertise, the companies will work together to strengthen domestic supply chains across the U.S. and accelerate the deployment of advanced AI systems. Building this infrastructure in the U.S. is essential to strengthening supply chains and supporting continued American leadership in AI. This new initiative will focus on three core efforts:  Designing for multiple generations of data center hardware: OpenAI and Foxconn will co-design, engineer, and develop multiple generations of AI data center racks in parallel to keep pace with rapidly advancing model needs. By combining OpenAI’s infrastructure roadmap with Foxconn’s engineering and manufacturing expertise, we can bring new systems online faster and secure capacity for long-term growth. Strengthening and simplifying the U.S. AI supply chain: Together, we will work to improve rack architecture so it can be manufactured across the U.S., broaden sourcing to include more chipsets and domestic suppliers, and expand localized testing and assembly. This will improve reliability, speed deployment, and strengthen the ecosystem, building a more resilient and scalable American supply chain. Building critical AI data center components in the U.S.: Foxconn will manufacture key equipment for AI data centers – including cabling, networking, cooling, and power systems – in the U.S. This will support the rapid construction of high-performance compute infrastructure and help ensure the economic benefits reach workers and manufacturers in order to meet the demands of AI workloads today and in the future.   “We at Foxconn are thrilled to partner with OpenAI – a pioneer at the forefront of the AI digital age,” said Foxconn Chairman Young Liu.  “As the world’s largest manufacturer of AI data servers, Foxconn is uniquely positioned to support OpenAI’s mission with trusted, scalable infrastructure that accelerates innovation and broadens access to transformative AI capabilities for businesses and users worldwide.”   “The infrastructure behind advanced AI is a generational opportunity to reindustrialize America,” said Sam Altman, CEO of OpenAI. “This partnership is a step toward ensuring the core technologies of the AI era are built here. We believe this work will strengthen U.S. leadership and help ensure the benefits of AI are widely shared.”   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

·      3Q25 gross, operating, net profits all at record highs for period ·      4Q25 to see significant growth QoQ and YoY ·      Cloud & networking is growth driver; smart consumer electronics improves outlook ·      Maintains significant growth view for FY 2025; outlook for 2026 is optimistic12 November 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced its third quarter 2025 financial results. Revenue and profit – on a gross, operating and net basis – for the third quarter and the first three quarters of this year all reached record highs for their same periods. Earnings per share of NT$4.15 and NT$10.38, respectively, both showed significant growth compared to the same respective periods last year. Looking ahead to the final quarter of 2025, significant growth is seen on-quarter and on-year. The company maintained its significant growth target for the full year, while offering for the first time, optimism about performance in 2026. In the July-September period, revenue reached NT$2.06 trillion, a year-on-year increase of 11%. Gross profit reached NT$130.8 billion, up 14% for the same period; operating profit at NT$70.5 billion, rose 29%; while net profit (attributable to the parent company's owners) was NT$57.7 billion, climbing 17% at the same time. Compared to the second quarter, across-the-board on-quarter gains were a respective 15%, 15%, 25%, and 30% for revenue, gross profit, operating profit and net profit. Quarterly EPS of NT$4.15, was up NT$0.6 from NT$3.55 in the same period last year, and an increase of NT$0.96 from the second quarter. Gross margin, operating profit margin, net profit margin reached a respective 6.35%, 3.43%, 2.80%, also improving across-the-board compared to the same period last year. In the January-September period, cumulative revenue reached NT$5.5 trillion, a year-on-year increase of 16%. Gross profit at NT$344.8 billion, rose 16% for the same period; operating profit at NT$173.6 billion, jumped a higher 28%; and net profit was NT$144.1 billion, up 35% for the same period. Gross profit margin, operating profit margin, net profit margin reached 6.27%, 3.16%, 2.62%, respectively, indicating improved profitability in the core business. EPS for the first three quarters of this year reached NT$10.38, an increase of NT$2.71 compared to NT$7.67 in the same period last year. Looking ahead to the fourth quarter, the company is optimistic about the performance of AI and smart consumer electronics, which are expected to show significant growth momentum both quarter-on-quarter and year-on-year. Regarding the full-year outlook for 2025, Foxconn Chairman Young Liu stated that he maintains his view of significant growth for the full year, but revised upwards the full-year outlook for smart consumer electronics products to flat from a previous view for a slight decline. Among the four major product categories, cloud and networking products remain the main growth driver this year. Looking ahead to 2026, Chairman Liu offered a very optimistic outlook. He pointed out the development of the AI industry, the political and economic situation, and monetary policy will be the most important influencing factors next year – the development of the AI industry being the most positive and crucial. The company is optimistic about the AI field, expecting closer collaboration with major customers, expansion into more diverse AI solutions, and securing more orders. Regarding the traditional ICT industry, he is cautiously optimistic, noting that in addition to stable business, there is potential demand for upgrades and new product development. Regarding how Foxconn can continue to achieve success in the emerging AI industry, Chairman Liu stated that EMS is an industry that combines technology, capital, labor, and management skills for competition. The industry is ever-changing and customers’ new products are constantly evolving, Foxconn consistently provides customers five core values – speed, quality, engineering services, flexibility, and cost. Through these values, the company assists customers to achieve rapid market entry, quickly meet cost targets, and promptly grasp technological innovations to create competitive products during the product development and mass production stages. As long as high-tech products have these requirements, Foxconn can leverage its strengths. Chairman Liu emphasized that Foxconn's past competitive advantages in scale, automation, global footprint, vertical integration, and R&D technology have led to its success in the ICT industry. Now, it will extend these advantages to the AI and EV industries, becoming an indispensable partner for its customers. In the future, for any new products, whether in AI servers, electric vehicles, robotics, or even the aerospace field, Foxconn will be the preferred partner for its customers. Discussing the Group’s “three-pillar” operational performance, Chairman Liu said from a product portfolio view, the move into traditional peak season for ICT products has led to the proportion of Smart Consumer Electronics rising from 35% to 37%, marking the largest degree of increase when compared to the earlier quarter. Meanwhile, strong growth in AI servers lifted the share of Cloud and Networking Products from 41% in the previous quarter to 42%, keeping it as the largest contributor to overall revenue. Foxconn Spokesperson James Wu stated that the AI industry continues to expand at a rapid pace, driven by strong computing power demand and the mass production of next-generation AI server racks. Third-quarter AI server rack shipments grew 300% quarter-on-quarter, enabling cumulative AI server revenue to reach the “NT trillion-dollar scale” ahead of schedule. Looking to the fourth quarter, shipments of next-generation AI server racks are expected to sustain double-digit sequential growth. According to market projections, the top five U.S. cloud service providers (CSPs) are expected to invest nearly US$600 billion in capital expenditure in 2026, underscoring the continued strength of AI server demand. Currently, Foxconn maintains deep partnerships with leading CSPs in North America, having expanded its AI server rack product line from GPU-based to ASIC-based solutions. Beyond CSPs, the Group is also participating in sovereign AI initiatives in the United States, Taiwan, and Japan. Foxconn anticipates its AI server market share to rise above the current 40% level in 2026. The company, which is collaborating with NVIDIA to build a supercomputing center, has become the first NVIDIA Cloud Partner (NCP) in Taiwan, providing computing resources to industry, government and academia, solidifying its leadership as a pioneer in sovereign AI. Regarding the second pillar of Smart Consumer Electronics, Chairman Liu said the business is entering fourth-quarter peak shipment season, with strong growth expected on a sequential basis. Based on current visibility, shipment momentum is projected to outpace last year’s levels. Regarding EVs, the third operational pillar, Chairman Liu noted the global automotive industry is approaching an “outsourcing breaking point,” similar to the evolution of PCs in the 1990s, when the industry shifted to professional specialization. Traditionally, automakers have relied on a vertically integrated manufacturing model. However, rising cost pressures and intensifying competition are prompting a gradual shift toward specialized manufacturing services. Foxconn possesses advantages with its Contract Design and Manufacturing Service (CDMS) model and expects a significant increase in opportunities for outsourced manufacturing and design services. Among recent developments, Foxconn has brought in Mitsubishi Fuso as its second Japanese automaker customer. The two companies will jointly develop zero-emission buses based on the MODEL T and MODEL U platforms, expanding into international markets. Meanwhile, Foxconn is collaborating with Stellantis, NVIDIA, and Uber on Level 4 autonomous driving technologies, for which Foxconn is responsible for hardware-software integration. In addition, subsidiary FIT's joint venture with Saudi Arabia, Smart Mobility, is expected to start construction on an EV charging station manufacturing base in the Middle East before the end of the year, with production starting as early as 2026. Lastly, Hon Hai Tech Day (HHTD25), Foxconn’s flagship annual technology conference, will be held November 21-22 at Taipei Nangang Exhibition Center with the second day open and free to the public. This year’s theme, “Comprehensive AI integration across Hon Hai (Foxconn)'s three smart platforms,” will highlight nine areas – including AI factory, robotics, and semiconductors – demonstrating the Group’s vertical integration and “3+3+3” transformation strategy. For the first time, the event will feature a dedicated mobile app integrating registration, navigation, and interactive functions. China Airlines has created a unique VIP Lounge, providing guests with a digital and immersive experience.   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

6 November 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) has signed a Memorandum of Understanding with Mitsubishi Electric Corporation to collaborate on the global supply of energy-efficient and highly reliable AI data center solutions. Under the MOU, the two companies will cooperate comprehensively in the field of AI data centers by utilizing the know-how and networks of both companies and supply competitive solutions for AI data centers with high efficiency and high reliability on a global basis, thereby contributing to solving social issues such as the realization of a circular economy. In the future, the two companies aim to jointly create new values, solutions and business models outside the AI data center field by leveraging their knowledge assets in the process of addressing social issues such as sustainability.About Mitsubishi Electric Corporation The Mitsubishi Electric Group is committed to contributing to the realization of a vibrant and affluent society through continuous technological innovation and unlimited creativity. We will realize sustainability by accelerating "Trade On" activities to develop our business while enriching society and the environment. We also utilize our Serendie ® digital platform to collect and analyze data obtained from customers in a digital space. We also promote circular digital engineering, which creates new value and contributes to solving social issues through strong connections within the Group and the sharing of knowledge. With a history of more than 100 years since its founding in 1921, the company has developed businesses including social systems, energy systems, defense and space systems, FA systems, automotive equipment, building systems, air conditioning and home appliances, digital innovation, and semiconductors and devices. With more than 200 Group companies and approximately 150,000 employees worldwide, consolidated sales in fiscal 2024 were 5,521.7 billion yen. For more information, visit www.MitsubishiElectric.co.jp   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

31 October 2025, Taipei, Taiwan – QunaSys, a leading innovator in quantum-chemistry      software with a Japan–Europe footprint, and      Hon Hai Research Institute, the      research arm of Hon Hai Technology Group (Foxconn), today announced the acceptance of their joint research paper “Neural Network Assisted Fermionic Compression Encoding: A Lossy-QSCI Framework for Scalable Quantum Chemistry Simulations” in Physical Review Research. This is the first major research achievement completed following the announcement in 2024 of the collaboration between the two parties to develop advanced fermionic encoding methods. The paper presents a new framework that combines advanced fermionic encoding with neural-network–assisted decoding to enable more efficient and scalable quantum chemistry simulations. Demonstrated on molecular systems, the method achieves chemical accuracy with fewer qubits and reduced computational overhead, opening a practical path toward applications on both near-term and fault-tolerant quantum hardware.In the core design of Lossy-QSCI, the RLE method developed by Hon Hai Research Institute effectively compresses the resources required for VQE calculations and enhances the efficiency of QSCI developed by QunaSys. This research focuses on the challenges of applying quantum computers to chemical simulations, as traditional approaches often require a large number of qubits and massive computational resources, far exceeding the capacity of existing quantum hardware. To address this issue, QunaSys proposed the Quantum Selected Configuration Interaction (QSCI) method, which was later extended by IBM into the Sampling-based Quantum Diagonalization (SQD) framework and successfully demonstrated on IBM’s quantum computer with a 76-qubit simulation. Although the experimental results were remarkable, the quantum advantage of QSCI over traditional computation methods rooted in chemical knowledge remained under scrutiny due to numerical challenges. To overcome this limitation, the joint research team leveraged patented results from Hon Hai Research Institute and introduced a novel “Fermionic Compression Encoding” framework, enhanced with machine-learning–assisted decoding. This approach effectively utilizes established chemical knowledge to compress the information content of molecular systems while maintaining simulation accuracy. In simple terms, it equips quantum computers with a “smart compression tool,” enabling them to perform more efficient and accurate chemical simulations with fewer resources. This breakthrough carries significant potential value for industries. In pharmaceuticals, it could accelerate the design of new drug molecules. In materials science and renewable energy, it can speed up the simulation and discovery of next-generation batteries, catalysts, and advanced materials. For the quantum industry, the framework helps address current hardware limitations, enabling near-term quantum computers to demonstrate more practical applications while laying the foundation for future fault-tolerant quantum systems. This study not only highlights the convergence of AI and quantum science but also provides a concrete and feasible pathway for bringing quantum computing into industrial applications. Looking Ahead QunaSys and Hon Hai Research Institute will continue to strengthen their collaboration by: ●   Identifying practical use cases where quantum algorithms can bring clear benefits to industry. ●    Developing novel quantum algorithms optimized for those use cases. ●     Working toward integration of these algorithms into real-world applications and product lines. Through these efforts, the two organizations aim to ensure that advancements in quantum research translate directly into industrial impact, helping accelerate the broader adoption of quantum technologies.   Physical Review Research, launched in 2019 by the American Physical Society (APS), is dedicated to publishing cutting-edge research across physics and interdisciplinary fields. Known for its broad scope and high visibility, the journal rapidly disseminates scientific advances worldwide. According to the latest Journal Citation Reports, it has an Impact Factor of approximately 4.5 and is ranked in the top 25% (Q1) of journals across physics and interdisciplinary categories, underscoring its strong and consistent influence.   Hon Hai Research Institute (HHRI), established in 2020 under the Hon Hai Technology Group, comprises five research institutes and one laboratory. Each unit is staffed by high-tech research professionals focused on forward-looking technologies over a three- to seven-year horizon, aiming to strengthen Hon Hai’s long-term technology and product innovation, support the Group’s shift toward being “intelligence-driven,” and enhance the competitiveness of Hon Hai’s “3+3+3” operating strategy.   QunaSys is a quantum-software company originating in Japan with a growing European presence. The company builds the QURI toolchain (SDK, VM, benchmarks) to prototype algorithms, estimate resources, and run reproducible workflows across simulators and quantum hardware—helping research and industry accelerate progress in chemistry and materials.

TAIPEI, Oct. 30, 2025 – FIH, a subsidiary of Hon Hai Technology Group (Foxconn),announced that it has received the EcoVadis Silver medal, a global trusted provider in sustainability ratings. FIH ranks in the top 8% of all rated companies worldwide, demonstrating outstanding performance across the four core sustainability themes of "Environment," "Labor & Human Rights," "Ethics," and "Sustainable Procurement."FIH Head of Quality System, Barry Tsai, stated, “Receiving EcoVadis Silver medal reflects FIH's progress in sustainability performance and our commitment to the quality culture. FIH has established clear ESG goals and a robust management system, and we regularly disclose sustainability information to ensure transparency. FIH takes real actions to fulfill its corporate social responsibility, continuously creating value for customers and becoming the most trusted supply chain partner.”   Among the four sustainability themes of EcoVadis, FIH performed particularly well in “Environment,” receiving full scores across multiple indicators. The company established quantitative targets for key sustainability issues, aiming to reduce environmental impact and manage related risks. In addition to maintaining the ISO 14001 Environmental Management System and ISO 50001 Energy Management System certifications, FIH actively participates in international sustainability ratings such as CDP to verify its environmental management effectiveness. Furthermore, FIH fully discloses its Scope 1, 2, and 3 greenhouse gas (GHG) emissions, along with water- and waste-related data, ensuring transparency in its environmental reporting.   FIH also demonstrated strong progress in other sustainability themes. Regarding “Labor and Human Rights,” the company’s main operational sites have undergone third-party audits through the Responsible Business Alliance (RBA) Verified Assessment Program (VAP), actively protecting employees’ human rights and occupational health and safety. In terms of “Ethics,” FIH continues to strengthen its business ethics policies and anti-corruption measures. In September 2025, FIH successfully obtained ISO 37001 Anti-Bribery Management System certification, further enhancing transparency and compliance. For “Sustainable Procurement”, FIH conducts comprehensive supplier risk assessments and audits. It also utilizes a Scorecard system to evaluate suppliers’ ESG, quality, and technical support performance, establishing a Preferred Supplier List to build robust partnerships and promote the long-term development of a sustainable supply chain.   EcoVadis covers more than 185 countries, 250 industries, and 150,000 companies, serving as a key benchmark for supply chain collaboration and procurement decisions. Since participating in the assessment in 2021, the company has continuously improved its performance across all four sustainability themes. Looking ahead, FIH will continue advancing sustainable development through concrete actions, working with partners to build a more resilient supply chain and enhance global competitiveness.   About FIH Mobile Limited FIH Mobile Limited, a subsidiary of Hon Hai Technology Group (Foxconn), was established in May 2003 and listed on the Hong Kong Stock Exchange in 2005 (Ticker: 2038.HK). Leveraging its core technologies in handset ODM and its experience in hardware-software integration, FIH focuses on three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics and provides exceptional engineering/manufacturing services and solutions to industry-leading customers.   For more information about FIH Mobile Limited, please visit the official website: http://www.fihmobile.com.